CHARACTERISTICS |
CONNECTCORE 6 |
Application processor |
Freescale i.MX 6 Solo / DualLite / Dual / Quad Cortex-A9 core, 1 to 4 cores, up to 1.2 GHz each 32 KB I-Cache / 32 KB D-Cache, up to 1 MB L2 Cache |
Memory |
Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit) |
PMIC |
Dialog DA9063 |
Display |
Multi-stream HD video engine with 1080p60 decoding, 1080p30 encoding and 3D video playback in HD in high-performance families Superior 3D graphics performance with up to 4 shaders at 200 Mt / s with OpenCL support Independent 2D and / or Vertex acceleration motors for User interface support Stereoscopic image sensor holder for 3D imaging |
security |
RNG, TrustZone, Ciphers, security control, RTC, secure, secure JTAG, eFuses (OTP) |
Peripherals / interfaces |
MMC 4.4 / SD 3.0 x3MMC 4.4 / SDXC, UART x5 (5 Mbps), MIPI HSI, S / PDIF Tx / Rx, I2C x3, SPI x5, ESAI, I2S / SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, keyboard, PCIe 2.0 (x1), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, external address / data bus, Watchdog, Timers, JTAG |
External bus |
26-bit address / up to 32 data bits (multiplexed and non-multiplexed modes) |
Ethernet |
1 Gigabit Ethernet + IEEE 1588 (MII10, MII100, RMII, RGMII) |
Wireless |
802.11a / b / g / n: 2412 - 2484 GHz, 4900 - 5850 GHz 802.11b: 1, 2, 5.5, 11 Mbps (17 dBm ± 2 dBm typical) 802.11a / g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm ± 2 dBm typical) 802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm ± 2 dBm typical) HT40, MCS 0-7 security: WEP, WPA-PSK / WPA2-Personal, WPA / WPA2 Enterprise, 802.11i Access point mode (up to 10 clients), Wi-Fi Direct Industry certifications: Wi-Fi Alliance Certification Logo Ready, CCXv4 TSA Loan |
Bluetooth |
Bluetooth 4.0: Class 1.5, Bluetooth 2.1 + EDR, Bluetooth 3.0 + HS 802.11 AMP, Bluetooth Low Energy Profiles: GAP, SPP, HSP, HFP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP |
Assistance microcontroller
on board
|
Kinetis KL2 (Cortes-M0 +) MKL26Z128VFT4 / MKL26Z64VFT4 / MKL2632VFT4 or Kinetis K20 (Cortex-M4) MK20DN32VFT5 / MK20DX32VFT5 / MK20DN64VFT5 / MK20DX64VFT5 / MK20DN128VFT5 / MK20DX128VFT5 Independent operation with interconnection to i.MX6 via SPI |
Operating temperatures |
Industrial: -40 ° C to + 105 ° C; extended commercial: -20 ° C to + 105 ° C / Commercial: 0 ° C to + 95 ° C |
Storage temperature |
Storage temperature -50 ° C to + 125 ° C (-58 ° F to + 257 ° F) |
Relative humidity |
Relative humidity 5% to 90% (non-condensing) |
Altitude |
3,658 meters |
Radio approvals |
United States, Canada, EU, Japan, Australia / New Zealand |
Emissions / Immunity / Safety |
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15, subsection C 15247, IC (Industry Canada), RSS-210 Issue 5 section 6.2.2 (o), EN 300 328, EN 301 489-17, EN Minnesota, 55024, EN 301 489-3, UL / UR Safety (or equivalent) |
Design certificates
|
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibrations / shocks: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
Dimensions |
50mm x 50mm x 5mm, fully shielded LGA-400, 2mm pitch |