Description
Low-thickness thermal caps with good thermal performance after compression.
This format is extremely easy to implement as long as components with standard packaging are used (TO-220).
In addition to higher thermal conduction, these caps provide electrical insulation and a buffer effect.
This format is extremely easy to implement as long as components with standard packaging are used (TO-220).
In addition to higher thermal conduction, these caps provide electrical insulation and a buffer effect.
| Parameters | Units | CP22/CP23/CP33 | Test |
| Thermal conductivity |
[W/mK] |
2.0 | ASTM D5470 |
| Thickness |
[mm] |
0.30/0.45 | ASTM D374 |
| Color |
[-] |
Gray | Visual |
| Hardness |
[-] |
Shore A 65 | ASTM D2240 |
| Dielectric dress (Vac) |
[kV] |
4.1/6.1 | ASTM D149 |
| Dielectric dress (Vdc) |
[kV] |
6.1/8.1 | ASTM D149 |
| Elongation |
[%] |
50 | ASTM D412 |
| Flame propagation |
[-] |
V-0 | UL 94 |
| Temperature of use |
[C] |
45 degrees Celsius - 180 degrees Fahrenheit | - |
| Datasheet |
[-] |
 |
- |
Tables given as an indication
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